Applied Materials has been a major player in the semiconductor equipment scene for a long time. They really got things moving back in the day, especially with their work on cluster tools. Before these ...

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Abstract: The Wafer Sort process in Semiconductor Manufacturing identifies die defects before assembly into packages. A wafer prober verifies each die on a wafer by making precise ...

Abstract: We propose a novel 3D integration method, called Vertical integration after Stacking (ViaS) process. The process enables 3D integration at significantly low cost, since it eliminates costly ...